Opportunity Title:
CHIPS Incentives Program – Commercial Fabrication Facilities
Funder/Agency:
National Institute of Standards and Technology (NIST), United States Department of Commerce
Opportunity Number:
2023-NIST-CHIPS-CFF-01
Description:
The CHIPS Incentives Program aims to catalyze long-term economically sustainable growth in the domestic semiconductor industry in support of U.S. economic and national security. This is the first Notice of Funding Opportunity under this program. It seeks applications for projects for the construction, expansion, or modernization of (a) commercial facilities for the front- and back-end fabrication of leading-edge, current- generation, and mature-node semiconductors; (b) commercial facilities for wafer manufacturing; and (c) commercial facilities for materials used to manufacture semiconductors and semiconductor manufacturing equipment, provided that the capital investment equals or exceeds $300 million.
The CHIPS Incentives Program seeks to fund applicants that demonstrate a commitment to
investment in the United States for the long term and projects that maximize private sources of capital. Only private industry can marshal the resources necessary to make the sustaining investments needed in the decades that follow to maintain a resilient, economically viable, and growing U.S. semiconductor industry.
Eligibility:
An applicant must be a “covered entity” to receive CHIPS Incentives. For purposes of this
NOFO, a “covered entity” means a nonprofit entity; a private-sector entity; a consortium of
private-sector entities; or a consortium of nonprofit, public, and private-sector entities with a
demonstrated ability to substantially finance, construct, expand, or modernize a facility relating to fabrication, assembly, testing, advanced packaging, or production of semiconductors, materials used to manufacture semiconductors, or semiconductor manufacturing equipment.
Award Details:
Total Amount Available:
$38,220,000,000
Deadline:
Rolling: Statement of interest must be submitted at least 21 days prior to submitting a pre-application or full application.
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