Opportunity Title:
FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates
Funder/Agency:
United States Department of Commerce (DOC), National Institute of Standards and Technology (NIST)
Opportunity Number:
2024-NIST-CHIPS-NAPMP-01
Description:
This NOFO seeks applications for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials. Through this NOFO, the NAPMP program seeks to achieve the following objectives:
Accelerate domestic R&D and innovation in advanced packaging materials and substrates;
Translate domestic materials and substrate innovation into U.S. manufacturing, such that these technologies are available to U.S. manufacturers and customers, including to significantly benefit U.S. economic and national security;
Support the establishment of a robust, sustainable, domestic capacity for advanced packaging materials and substrate R&D, prototyping, commercialization, and manufacturing; and
Promote a skilled and diverse pipeline of workers for a sustainable domestic advanced packaging industry
On March 12, 2024, CHIPS for America’s NAPMP Program will host a one-day meeting for potential applicants for this funding opportunity. For more information and to register for this event, please visit chips.gov.
Eligibility:
Domestic for-profit organizations
Non-profit organizations
Accredited institutions of higher education including community and
technical colleges
State, local, territorial, and Indian tribal governments
Award Details:
Total Amount Available:
$300,000,000
Deadline:
Concept Papers Due April 12, 2024
Applications Due July 03, 2024
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