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DOC CHIPS for America National Advanced Packaging Manufacturing Program (NAPMP): Materials & Substrates – Concept Papers Due 04/12; Full Applications Due 07/03; Workshop 03/12

Opportunity Title:

FY2024 CHIPS R&D National Advanced Packaging Manufacturing Program (NAPMP) Materials & Substrates



United States Department of Commerce (DOC), National Institute of Standards and Technology (NIST)


Opportunity Number:




This NOFO seeks applications for research and development activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials. Through this NOFO, the NAPMP program seeks to achieve the following objectives:

  1. Accelerate domestic R&D and innovation in advanced packaging materials and substrates;

  2. Translate domestic materials and substrate innovation into U.S. manufacturing, such that these technologies are available to U.S. manufacturers and customers, including to significantly benefit U.S. economic and national security;

  3. Support the establishment of a robust, sustainable, domestic capacity for advanced packaging materials and substrate R&D, prototyping, commercialization, and manufacturing; and

  4. Promote a skilled and diverse pipeline of workers for a sustainable domestic advanced packaging industry

On March 12, 2024, CHIPS for America’s NAPMP Program will host a one-day meeting for potential applicants for this funding opportunity. For more information and to register for this event, please visit


  • Domestic for-profit organizations

  • Non-profit organizations

  • Accredited institutions of higher education including community and

  • technical colleges

  • State, local, territorial, and Indian tribal governments


Award Details:

Total Amount Available:




Concept Papers Due April 12, 2024

Applications Due July 03, 2024



Grant Management Associates has years of experience with opportunities like this one. Contact us today for a consultation.

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