Opportunity Title:
Advanced Chip Engineering Design and Fabrication
Opportunity Number:
22-636
Description:
The Directorate for Engineering (ENG), Division of Electrical, Communications and Cyber Systems (ECCS), Division of Chemical, Bioengineering, Environmental, and Transport Systems (CBET), Division of Civil, Mechanical and Manufacturing Innovation (CMMI), Division of Engineering Education and Centers (EEC), and The Office of International Science and Engineering(OISE) of the National Science Foundation (NSF) and the Department of Engineering and Technologies (DET) of the Taiwan National Science and Technology Council (NSTC) are pleased to announce and launch an NSF-NSTC semiconductor collaboration program titled “Advanced Chip Engineering Design and Fabrication (ACED Fab)”. This program aims to leverage the complementary academic talent and engineering strengths of semiconductor research in the U.S. and Taiwan to enable chip design and fabrication to advance semiconductor science, engineering, and education. This partnership program is guided by the Memorandum of Understanding (MOU) and Implementing Arrangement for Cooperation in Advanced Semiconductor Chip Design and Fabrication signed by the American Institute in Taiwan (AIT) and the Taipei Economic and Cultural Representative Office in the United States (TECRO). The MOU provides guidelines for a collaborative arrangement whereby U.S. researchers may receive funding from NSF and Taiwan researchers may receive funding from the Taiwan National Science and Technology Council (NSTC). Through a lead agency model, NSF and NSTC, as AIT and TECRO’s Designated Representatives under the MOU, respectively, invite U.S. and Taiwan researchers to submit a single collaborative proposal that will undergo a single review process at NSF, which will be the lead agency. NSTC will honor the NSF merit review process and will coordinate with NSF on award decisions. Awards to researchers in the U.S. and Taiwan will be issued in parallel by NSF and NSTC, respectively.
Eligibility:
Who May Submit Proposals: Proposals may only be submitted by the following: -Institutions of Higher Education (IHEs) - Two- and four-year IHEs (including community colleges) accredited in, and having a campus located in the US, acting on behalf of their faculty members.Special Instructions for International Branch Campuses of US IHEs: If the proposal includes funding to be provided to an international branch campus of a US institution of higher education (including through use of subawards and consultant arrangements), the proposer must explain the benefit(s) to the project of performance at the international branch campus, and justify why the project activities cannot be performed at the US campus.
Total Amount Available:
$6,000,000
Application Deadline:
January 17, 2023
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