Opportunity Title:
Future Semiconductors-Teaming for Co-Design Research Capacity (FuSe Teaming Grants)
Opportunity Number:
22-589
Description:
The current state of semiconductor microelectronic systems is at a crossroads. Continued advances in the range and capabilities of our technologies as well as reducing their cost of applications across computing, sensing, and communications represent a tremendous opportunity. The technology has expanded following the trends in miniaturization long characterized by Moore’s Law, underpinned by new materials, processes, devices, and architectures. The developments in these underpinning areas have often progressed independent of the application area, delaying their incorporation into the next-generation technologies. Closing that gap between the essential components in the technology stack, from materials through devices to systems, is now required to ensure further progress. The materials, devices and systems need to be co-designed, that is, designed with simultaneous consideration of as many elements of the technology chain as possible, spanning materials, devices, circuits, architectures, software, and applications. Furthermore, developing a sufficient pool of diverse and multi-disciplinary talent suitable for workforce participation in the US is also essential for the future success of the semiconductor microelectronics field. In addition to fundamental and applied research, rapid developments in the vibrant field of semiconductors also offer new and unique opportunities and challenges when it comes to workforce preparation, education, and broadening participation. Co-design has been widely recognized in government and industry studies as means to accelerate advances in semiconductor technology. A holistic, co-design approach can more rapidly create high-performance, robust, secure, compact, energy-efficient, and cost-effective solutions. The technological challenges that are overcome by co-design approaches include: dramatically reducing the energy consumption of the existing computation and communication systems; reducing the impact of device and system manufacturing on the environment; increasing performance speed and capacity; and developing novel computing systems.
Total Amount Available:
$10,000,000
Application Deadline:
July 18, 2022
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